Some suppliers of cell-to-chassis solutions 3M www.3m.com Avery Dennison www.tapes.averydennison.com Bostik www.bostik.com Dow Corning www.dow.com DuPont www.dupont.com Ennovi www.ennovi.com HB Fuller www.hbfuller.com Henkel www.henkel-adhesives.com Lohmann www.lohmann-tapes.com Parker Lord www.parker.com Rogers www.rogerscorp.com Unitech www.unitechcorp.com 41 Cell-to-chassis | Tech focus The next goal is to push the limits of material science such that when a vehicle needs to be recycled, the process can be achieved in a costeffective, low-energy way without having to deal with hazardous materials. Today, considerable time and energy are required in using chemicals to act as a ‘chisel’ to dissolve the encapsulant. Material developers are now looking at ways to implement debonding on demand where a chemical lever is applied and everything comes loose. This is already possible using certain technologies in specific conditions, for example, with certain frequencies of light, but developers have yet to release an encapsulant that can be debonded on demand. Other options include thermal debonding and electrical delamination; however, chemical debonding is of more interest because it is preferable to keep heat away from the cells. With electrical delamination, a current is applied to stimulate a chemical reaction that causes the interface bonds to drop to almost zero, thereby initiating debonding. Although work on this process is still in the development phase, it is in an advanced state. Research has demonstrated that it is possible to debond modules using an electric current and the process has passed validation tests. However, this has implications regarding chassis design because additional substrates are required for application of the external voltage. The current is applied to the area that needs to be debonded via connections to the substrates from specific parts of the chassis. Conclusion New developmental, thermally conductive adhesives have been designed to directly bond PET to aluminium under stringent environmental conditions. Unlike CTM gap fillers, these adhesives can deliver substantial thermal conductivity while also maintaining high levels of adhesion after 1000 hours of ageing at 85 C and 85% RH, and they mark a significant step toward the adoption of C2C architecture. Such properties, coupled with the characteristics of low density, suitable flow characteristics and a low dielectric constant, are key to enabling battery and EV manufacturers achieve higher pack energy densities and reduce manufacturing costs. Acknowledgements With thanks to Germaine Mariaselvaraj and Marlen Valverde at HB Fuller, Tim Fornes and Susan Donaldson at Parker Lord and Elizaveta Kessler at Henkel. E-Mobility Engineering | May/June 2025 The Changan flagship AVATR EV is using a cell-to-chassis design (Image courtesy of Changan)
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